About us
Timeline












History
G&N is the former machines department of „Kugelmüller“ resp. Georg Müller Nürnberg AG. Development of the first grinding machines around 1930 by the Kugelmüller company. 1964 Development of the first European silicon grinding machine for ½“ wafers in cooperation with Siemens and the University of Erlangen.
Product range
G&N covers the complete range of surface grinding machines for the processing of metallic as well as non-metallic materials. These include ceramics, AlN, Al2O3, GaAs, GaN, Ge, InP, Si, SiC, Si2N4 and other brittle, difficult-tomachine materials for a wide range of high-tech applications.
The G&N programme ranges from semi-automatic machines for processing semiconductor materials and metals to fully automatic wafer grinding machines.
G&N today
90 years of Experience. Innovation. Development.
We use the experience gained and knowledge built up over the years for continuous optimisation and development.
- Approx. 25 employees R&D
- Design and construction
- Sales and after sales department
- Cooperation with representants worldwide